| 发明名称 |
OPTICAL SENSOR CHIP DEVICE AND CORRESPONDING PRODUCTION METHOD |
| 摘要 |
An optical sensor chip device and a corresponding production method. The optical sensor chip device includes a substrate having a front side and a rear side; at least one first optical sensor chip for acquiring a first optical spectral range, the chip being attached to the substrate; and a first sealed cavern fashioned above an upper side of the first optical sensor chip. The first optical sensor chip is situated on a first side of the first cavern, and a first optical device is situated on an opposite, second side of the first cavern. |
| 申请公布号 |
US2014225212(A1) |
申请公布日期 |
2014.08.14 |
| 申请号 |
US201414177722 |
申请日期 |
2014.02.11 |
| 申请人 |
KASCHNER Axel;KRUEGER Michael |
发明人 |
KASCHNER Axel;KRUEGER Michael |
| 分类号 |
H01L25/04;H01L25/00 |
主分类号 |
H01L25/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An optical sensor chip device, comprising:
a substrate having a front side and a rear side; at least one first optical sensor chip which is attached to the substrate to acquire a first optical spectral range; and a first sealed cavern fashioned above an upper side of the first optical sensor chip, wherein the first optical sensor chip is situated on a first side of the first cavern, and a first optical device is situated on an opposite, second side of the first cavern. |
| 地址 |
Pittsburgh PA US |
