发明名称 LIGHT EMITTING DEVICE PACKAGE MODULE
摘要 <p>The present invention relates to a light emitting device package module. The light emitting device package module of the present invention may comprise a light emitting device; a first circuit board which stores the light emitting device and is electrically connected to the light emitting device; and a second circuit board which is assembled with the first circuit board by using a connecting member and electrically connected the first circuit board.</p>
申请公布号 KR20140100325(A) 申请公布日期 2014.08.14
申请号 KR20130013492 申请日期 2013.02.06
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 YOON, YOUNG JEONG;CHOI, KI WON
分类号 H01L33/48;H01L33/64 主分类号 H01L33/48
代理机构 代理人
主权项
地址