发明名称 |
SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can stabilize wire bondability and improve a heat dissipation performance.SOLUTION: A semiconductor device manufacturing method comprises: die bonding a switching element 4 to a first region 5a of a lead frame 5; die bonding a driving element 6 for driving the switching element 4 to a second region 5b of the lead frame 5; placing the lead frame 5 on a heater plate 2 and bonding Au wires 9 to the driving element 6 while heating the second region 5b of the lead frame 5 and the driving element 6; and attaching an insulation sheet 10 to a rear face of the first region of the lead frame 5 after bonding the Au wires 9 to the driving element 6. When the lead frame 5 is placed on the heater plate 2, the first region 5a of the lead frame 5 is arranged on a recess 8 provided on a top face of the heater plate 2. |
申请公布号 |
JP2014146751(A) |
申请公布日期 |
2014.08.14 |
申请号 |
JP20130015620 |
申请日期 |
2013.01.30 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
SUEYOSHI TAKAHISA ; UMEZAKI YUJI ; KONDO SATOSHI ; IWAZAWA KAKU |
分类号 |
H01L21/60;H01L25/07;H01L25/18 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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