发明名称 HOLLOW OVERLAY MOLDING PROCESS AND SYSTEM
摘要 A molding apparatus has a first top assembly which includes a first, a second, and a third top molding station; and a bottom assembly which includes a first, a second, and a third bottom molding station. The top and bottom assemblies may be repositioned relative to one another so that in a first configuration the first, second, and third top stations are engaged with the first, second, and third bottom stations; and in a second configuration the first top and second bottom stations are engaged, the second top and third bottom stations are engaged, and the third top and first bottom stations are engaged. Further disclosed is an injection molding process carried out utilizing the apparatus.
申请公布号 US2014225305(A1) 申请公布日期 2014.08.14
申请号 US201414168124 申请日期 2014.01.30
申请人 Windsor Mold Inc. 发明人 Martyn Patrick;Maisonville Bradd
分类号 B29D23/00 主分类号 B29D23/00
代理机构 代理人
主权项 1. A hollow overlay molding process for molding a multipart, hollow article, said process comprising: A. providing a molding apparatus comprising: a top assembly having a first top station corresponding to a top portion of an article to be molded; a second top station; and a third top station corresponding to a top portion of the article to be molded; anda bottom assembly comprising a first bottom station; a second bottom station corresponding to a bottom portion of said article to be molded; and a third bottom station corresponding to a bottom portion of said article to be molded;wherein said top assembly and said bottom assembly may be selectably repositioned relative to one another so that the molding apparatus may be disposed in: a first configuration wherein said first top station is engageable with said first bottom station; said second top station is engageable with said second bottom station; and said third top station is engageable with said third bottom station; anda second configuration wherein said first top station is engageable with said second bottom station; said second top station is engageable with said third bottom station; and said third top station is engageable with said first bottom station; B. disposing said top and bottom assembly in said first configuration; injection molding a top portion of a first article in said first top station; and injection molding a bottom portion of said first article in said second bottom station; C. disposing said top and bottom stations in said second configuration so that the top portion and the bottom portion of the first article molded in step B are engaged; sealing said top portion and said bottom portion of said first article together whereby said first article is formed; injection molding a top portion of a second article in said third top station; and injection molding a bottom portion of said second article in said third bottom station; D. separating said top station from said bottom station and ejecting said first article from said apparatus; E. disposing said top and bottom assemblies in said first configuration so that the top portion and the bottom portion of said second article molded in step C are engaged; sealing said top portion and said bottom portion of said second article together whereby said second article is formed; injection molding a top portion of a third article in said first top station; and injection molding a bottom portion of said third article in said second bottom station; and F. separating said top station from said bottom station and ejecting said second article from said apparatus.
地址 Windsor CA