| 发明名称 |
LOW-COST CHIP PACKAGE FOR CHIP STACKS |
| 摘要 |
A chip package is described. This chip package includes a housing having a surface and a cavity, defined by an edge in the surface, with slots arranged at an angle relative to the surface. For example, the angle may be between 0° (in a plane of the surface) and 90° (perpendicular to the plane). Alternatively, the angle may be 0°. Moreover, the slots may be configured to accommodate a set of semiconductor dies arranged in a stack along a direction perpendicular to a plane of the slots, and the semiconductor dies may be offset from each other in a horizontal direction in the plane of slots so that one side of the stack defines a stepped terrace. |
| 申请公布号 |
US2014225284(A1) |
申请公布日期 |
2014.08.14 |
| 申请号 |
US201313764622 |
申请日期 |
2013.02.11 |
| 申请人 |
ORACLE INTERNATIONAL CORPORATION |
发明人 |
Thacker Hiren D.;Krishnamoorthy Ashok V.;Cunningham John E. |
| 分类号 |
H01L23/28;H01L21/82 |
主分类号 |
H01L23/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip package, comprising:
a housing having a surface and a cavity defined by an edge in the surface, wherein the cavity includes slots arranged at an angle relative to the surface; wherein the slots are configured to accommodate a set of semiconductor dies arranged in a stack along a direction perpendicular to a plane of the slots; and wherein the semiconductor dies are offset from each other in a horizontal direction in the plane of slots so that one side of the stack defines a stepped terrace. |
| 地址 |
Redwood City CA US |
