SEMICONDUCTOR CHIP WITH ATTACHED ANISOTROPIC ELECTROCONDUCTIVE FILM, SEMICONDUCTOR WAFER WITH ATTACHED ANISOTROPIC ELECTROCONDUCTIVE FILM, AND SEMICONDUCTOR DEVICE

摘要

Provided is a semiconductor chip or wafer with an attached anisotropic electroconductive film in which the connecting part can be inspected before connection, the number of electroconductive particles contributing to the connection can be predicted, and the alignment mark can be readily distinguished during connection. A semiconductor chip or wafer with an attached anisotropic electroconductive film, having a semiconductor chip or wafer having a plurality of circuit electrodes on one surface, and an anisotropic electroconductive film covering the circuit electrodes, wherein the semiconductor chip or wafer with an attached anisotropic electroconductive film is characterized in that the anisotropic electroconductive film contains an insulating resin component and electroconductive particles, and no less than 60% of all electroconductive particles contained in the anisotropic electroconductive film are present further towards the surface of the anisotropic electroconductive film than the average height of the circuit electrodes.