PACKAGING STRUCTURE, AND METHOD OF FORMING TRANSMISSION LINE OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a packaging structure and a method of forming its transmission line.SOLUTION: A method and a device for forming a semiconductor device package having a transmission line using a micro bump layer are disclosed. The micro bump layer includes a micro bump and a micro bump line which are formed between a device in a top portion and a device in a bottom portion. On the device in the bottom portion, a signal transmission line is formed using the micro bump line. A ground plane is formed using a redistribution layer (RDL) of the device in the bottom portion, or using an additional micro bump line. The RDL forming the ground plane includes an open slot. The devices in the top and bottom portions above and below the micro bump line have RDLs and form a part of the ground plane.