PROCESS AND APPARATUS FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES

摘要

An apparatus and method for processing wafer-shaped articles utilizes at least first and second liquid-dispensing nozzles, wherein a first liquid-dispensing nozzle is positioned closer to an axis of rotation than the second liquid-dispensing nozzle. A liquid supply system supplies heated process liquid to the nozzles such that process liquid dispensed from the first nozzle has a temperature that differs by an amount within a predetermined range from a temperature of process liquid dispensed from the second liquid-dispensing nozzle.

主权项

1. Apparatus for processing wafer-shaped articles, comprising:
a rotary chuck adapted to hold a wafer shaped article of a predetermined diameter thereon and to rotate the wafer shaped article about an axis of rotation, at least first and second liquid-dispensing nozzles that are mounted so as to be stationary relative to one another, wherein said first liquid-dispensing nozzle is positioned closer to said axis of rotation than said second liquid-dispensing nozzle, and a liquid supply system configured to supply process liquid to said first and second liquid-dispensing nozzles, said liquid supply system comprising one or more heaters, and said liquid supply system being configured to heat and supply process liquid such that process liquid dispensed from said first liquid-dispensing nozzle has a temperature that differs by an amount within a predetermined range from a temperature of process liquid dispensed from said second liquid-dispensing nozzle.