SYSTEM IN PACKAGE (SIP) WITH DUAL LAMINATE INTERPOSERS

摘要

There is provided a semiconductor device assembly with an interposer and method of manufacturing the same. More specifically, in one embodiment, there is provided a semiconductor device assembly comprising a semiconductor substrate, at least one semiconductor die attached to the semiconductor substrate, an interposer disposed on the semiconductor die, and a controller attached to the interposer. There is also provided a method of manufacturing comprising forming a first subassembly by coupling a substrate and a semiconductor die, and forming second subassembly by attaching a controller to an interposer, and coupling the first subassembly to the second subassembly.

主权项

1. A semiconductor device, comprising:
a first preassembled subassembly comprising:
a substrate; andat least one semiconductor die attached to the substrate; and a second preassembled subassembly coupled to the first preassembled subassembly and comprising:
an interposer; anda controller attached to the interposer.