DUAL SUBSTRATE, POWER DISTRIBUTION AND THERMAL SOLUTION FOR DIRECT STACKED INTEGRATED DEVICES

摘要

Some implementations provide an integrated device that includes a first substrate, a first die coupled to the first substrate, a second die coupled to the first die, and a second substrate coupled to the second die. The second substrate is configured to provide an electrical path for a signal to the second die. The integrated device further includes a molding surrounding the first die and the second die, and several through mold vias (TMVs) coupled to the second substrate. The TMVs are configured to provide an electrical path for the signal to the second die through the second substrate. In some implementations, the second substrate includes a signal distribution structure configured to provide the electrical path for the signal to the second die. In some implementations, the first substrate and the second substrate are part of a signal distribution network that provides signal to the second die.

主权项

1. An integrated device comprising:
a first substrate; a first die coupled to the first substrate; a second die coupled to the first die; and a second substrate coupled to the second die, the second substrate configured to provide an electrical path for a signal to the second die.