Optical Device Array Substrate Having a Heat Dissipating Structure Integrated with a Substrate, and Method for Manufacturing Same

摘要

The present invention relates to an optical device array substrate having a built-in heat dissipating structure, and to a method for manufacturing same, wherein the optical device array substrate itself is used as a heat sink and a coupling hole is formed at the bottom of the substrate to have a heat dissipating rod coupled thereto. The optical device array substrate having a built-in heat dissipating structure of the present invention consists essentially of: an optical device array substrate having a plurality of optical devices arranged on the top surface thereof and a plurality of coupling holes formed in the bottom surface thereof; and rod-shaped heat dissipating rods that have coupling projections formed on upper ends thereof, and are coupled to each of the coupling holes. In the above-described structure, the coupling holes are threaded, and the coupling projections are also threaded so as to be screw-coupled to the coupling holes. The coupling holes are formed having a downwardly narrowing taper, and the coupling projections are formed having a downwardly narrowing taper so as to be precisely coupled with the coupling holes even when in a contracted state under sub-freezing temperatures. The surfaces of the heat dissipating rods are characterized in that insulation coating layers are formed thereon and not on the coupling projections. A portion of the insulation coating layers on some of the heat dissipating rods may be removed to function as electrodes.

主权项

1. An optical device array substrate having a built-in heat dissipating structure comprising:
an optical device array substrate having multiple optical devices disposed on its upper surface and multiple coupling holes formed on its bottom surface; and a heat dissipating rod having a coupling projection formed on top thereof and being coupled into each of respective said coupling holes.