| 发明名称 |
LASER-INDUCED GAS PLASMA MACHINING |
| 摘要 |
Techniques for removing material from a substrate are provided. A laser beam is focused at a distance from the surface to be treated. A gas is provided at the focus point. The gas is dissociated using the laser energy to generate gas plasma. The substrate is then brought in contact with the gas plasma to enable material removal. |
| 申请公布号 |
US2014224776(A1) |
申请公布日期 |
2014.08.14 |
| 申请号 |
US201313797495 |
申请日期 |
2013.03.12 |
| 申请人 |
Lawrence Livermore National Security, LLC |
发明人 |
Elhadj Selim;Bass Isaac Louis;Guss Gabriel Mark;Matthews Manyalibo J. |
| 分类号 |
H01J37/32;B23K26/14;B81C1/00 |
主分类号 |
H01J37/32 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
providing a substrate having a first surface and an opposing second surface; focusing a laser beam at a focus point located at a predetermined distance from the first surface; providing a gas at or near the focus point; generating gas plasma by breaking down the gas using energy provided by the laser beam; exposing a portion of the first surface to the gas plasma; and removing material from the portion of the first substrate. |
| 地址 |
US |
