CURRENT RAMPING AND CURRENT PULSING ENTRY OF SUBSTRATES FOR ELECTROPLATING

摘要

In some method and apparatus disclosed herein, the profile of current delivered to the substrate provides a relatively uniform current density on the substrate surface during immersion. These methods include controlling the current density applied across a substrate's surface during immersion by dynamically controlling the current to account for the changing substrate surface area in contact with electrolyte during immersion. In some cases, current density pulses and/or steps are used during immersion, as well.

主权项

1. An apparatus for electroplating metal onto a surface of a substrate, comprising:
an electroplating chamber for holding electrolyte; a substrate holder for supporting a substrate during electroplating; a power supply for applying current to the substrate during electroplating; and a controller having instructions to:
position the substrate at an angle relative to a surface of electrolyte in the electroplating chamber;immerse the substrate in electrolyte in the electroplating chamber such that a leading edge of the substrate enters electrolyte before a trailing edge of the substrate, where the leading and trailing edges of the substrate are positioned opposite one another;apply a current to the substrate as it is immersed, where a current profile applied to the substrate during immersion is determined based on an amount of substrate area immersed in electrolyte at a given time; andremove the substrate from the electrolyte.