发明名称 |
HEAT-CONDUCTIVE ADHESIVE COMPOSITION, HEAT-CONDUCTIVE ADHESIVE SHEET, NONFLAMMABLE HEAT-CONDUCTIVE ADHESIVE COMPOSITION, NONFLAMMABLE HEAT-CONDUCTIVE ADHESIVE SHEET, HEAT-CONDUCTIVE INSULATION COATING, AND METAL MOLDED ARTICLE |
摘要 |
The present invention provides a heat-conductive adhesive composition including a polyurethane resin composition (A), an inorganic filler (B), and a photopolymerization initiator (C), the polyurethane resin composition (A) containing a polyurethane (a) having a (meth)acryloyl group and a polyoxyalkylene backbone, and a polymerizable monomer (b), and the content of the inorganic filler (B) being 250-700 parts by mass with respect to 100 parts by mass of the polyurethane resin composition (A). |
申请公布号 |
WO2014122866(A1) |
申请公布日期 |
2014.08.14 |
申请号 |
WO2013JP84159 |
申请日期 |
2013.12.19 |
申请人 |
SHOWA DENKO K.K. |
发明人 |
NAKANISHI, KENICHI;ITO, DAIGO;SASAKI, KAZUHIRO;TAKEUCHI, YUTA;IKEYA, TATSUHIRO;ARAI, YOSHIKAZU |
分类号 |
C09J175/14;C09D4/02;C09D7/12;C09D175/14;C09J4/02;C09J7/00;C09J11/04 |
主分类号 |
C09J175/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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