| 摘要 |
<p>PURPOSE: A light-emitting diode package is provided to reduce thermal stress by reducing the length of a wire interlinking light emitting diode chips through a pad installed between lead frames, thereby preventing the wire to be cut. CONSTITUTION: A first lead frame(22) and a second lead frame(23) apply a current to light emitting diode chips(24a, 24b). The first lead frame and the second lead frame comprise neighboring depressions. A body(21) comprises a filling unit(251). The filling unit supports the first lead frame and the second lead frame. A secondary electrode pad is installed in the filling unit. An opening is filled with encapsulating member(26) of optical permeability. The opening exposes the in light emitting diode chips.</p> |
