发明名称 Cleaning tape having embossing bump and manufacturing method for the same
摘要 The present invention relates to an embossing cleaning tape capable of adhering and removing dust or various foreign substances on a substrate, and a manufacturing method thereof, and, more specifically, to an embossing cleaning tape capable of adhering and removing dust or various foreign substances accumulated on a flat substrate surface as well as on a fine grooves formed on the surface of a substrate in case fine grooves are formed on the surface of the substrate by forming minute embossing projections on the surface through an embossing process, and a manufacturing method thereof.
申请公布号 KR101429685(B1) 申请公布日期 2014.08.13
申请号 KR20120054729 申请日期 2012.05.23
申请人 发明人
分类号 B05D5/10;B08B1/00;C09J7/02 主分类号 B05D5/10
代理机构 代理人
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