发明名称 |
EPOXY RESIN COMPOSITION, PREPREG, LAMINATE BOARD AND MULTILAYER BOARD |
摘要 |
<p>The present invention provides an epoxy resin composition having a high heat resistance such as a thermal decomposition temperature, as well as a high adhesive strength, in particular inner layer adhesive strength, and also provides a prepreg, a laminate board and a multi-layer board using the composition. The epoxy resin composition according to the present invention contains an epoxy resin containing nitrogen and bromine in the molecule, a curing agent having a phenolic hydroxyl group, and a silane compound having no cure acceleration action and having reactivity with the epoxy resin. The bromine content in a resin component of the epoxy resin composition is 10 mass% or greater.</p> |
申请公布号 |
EP2368929(A4) |
申请公布日期 |
2014.08.13 |
申请号 |
EP20090833468 |
申请日期 |
2009.12.17 |
申请人 |
PANASONIC CORPORATION |
发明人 |
NISHINO, MITSUYOSHI;SATOU, FUMINORI;FUJINO, KENTARO;NAKAMURA, YOSHIHIKO |
分类号 |
C08G59/30;C08G59/32;C08G59/62;C08J5/24;C08K3/00;C08K5/54;C08K5/5435;C08K5/5465;C08L63/00 |
主分类号 |
C08G59/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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