| 摘要 |
<p>Methods and compositions for precoating a substrate. The method comprises: applying to the substrate a curable precoat forming high solids composition comprising: UV curable resin forming components and a photoinitiator system; and applying UV radiation to cure the curable precoat forming component. The curable precoat forming component is not thermally cured. The high solid compositions may comprise a surface-cure photoinitiator and a through-cure photoinitiator and the UV radiation cures the precoat through its entire depth. A conductive additive in the form of a polymer, fiber, filler, powder etc can be added to facilitate and improve electrostatic adhesion of powders to the substrate.</p> |
