发明名称 |
Cover with a metallic grid modled into non-metallic structure and processing method thereof |
摘要 |
An electronic device (100) is provided including a plurality of electronic parts; one or more housing components (210,220) forming a space for receiving the plurality of electronic parts; and a cover (230) detachable from the one or more housing components (210,220), the cover (230) including a first member (231) having a plurality of metal elements (5311) suspended in a non-metal base (5320) and a second member (232) coupled to the first member (231). |
申请公布号 |
EP2764975(A2) |
申请公布日期 |
2014.08.13 |
申请号 |
EP20140153312 |
申请日期 |
2014.01.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD |
发明人 |
CHOI,, JONG-CHUL;MOON,, HEE-CHEUL;JUNG,, IK-SU |
分类号 |
B29C45/14;B29C45/00;H04M1/02 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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