发明名称 Cover with a metallic grid modled into non-metallic structure and processing method thereof
摘要 An electronic device (100) is provided including a plurality of electronic parts; one or more housing components (210,220) forming a space for receiving the plurality of electronic parts; and a cover (230) detachable from the one or more housing components (210,220), the cover (230) including a first member (231) having a plurality of metal elements (5311) suspended in a non-metal base (5320) and a second member (232) coupled to the first member (231).
申请公布号 EP2764975(A2) 申请公布日期 2014.08.13
申请号 EP20140153312 申请日期 2014.01.30
申请人 SAMSUNG ELECTRONICS CO., LTD 发明人 CHOI,, JONG-CHUL;MOON,, HEE-CHEUL;JUNG,, IK-SU
分类号 B29C45/14;B29C45/00;H04M1/02 主分类号 B29C45/14
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