SIDE-VIEW LED PACKAGE

摘要

A side view LED package is disclosed. The disclosed side view LED package comprises a metal substrate; a flip-chip typed LED chip which is die-bonded on the metal substrate; and a package body to form a cavity which is inclined at a predetermined angle to have a wider space as the cavity goes to an upper part and to be molded on the metal substrate. The side view LED package further comprises a phosphor which is molded on an outside surface of the LED chip and to form a side portion to be positioned in the lower region of the package body over a cavity area.