发明名称 |
FORMALDEHYDE-FREE ELECTROLESS COPPER PLATING SOLUTION |
摘要 |
The invention relates to an electroless aqueous copper plating solution, comprising a source of copper ions, a source of glyoxylic acid as reducing agent, and at least one polyamino disuccinic acid or at least one polyamino monosuccinic acid, or a mixture of at least one polyamino disuccinic acid and at least one polyamino monosuccinic acid as complexing agent, as well as to a method for electroless copper plating utilizing said solution and the use of the solution for the plating of substrates. |
申请公布号 |
EP2764135(A2) |
申请公布日期 |
2014.08.13 |
申请号 |
EP20120766668 |
申请日期 |
2012.10.01 |
申请人 |
ATOTECH DEUTSCHLAND GMBH |
发明人 |
STEINHÄUSER, EDITH;RÖSELER, SANDRA;WIESE, STEFANIE;NGUYEN, TANG, CAM, LAI;STAMP, LUTZ |
分类号 |
C23C18/40 |
主分类号 |
C23C18/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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