Method for scribing bonded substrates

摘要

[Object] To provide a scribing method according to which a stable scribing process can be carried out on the surface of the substrates which are bonded together with a sealing material on both sides. [Means for Achieving Object] The steps of: (a) creating a scribe line to be used for cutting a product on a first substrate side in the first substrate; (b) creating a scribe line for releasing stress in the vicinity of the center of an end material region between adjacent products in the second substrate separately from scribe lines used to cut products on the second substrate side; (c) creating a scribe line to be used for cutting a product on a second substrate side in the second substrate; and in addition, creating a scribe line for releasing stress in the vicinity of the center of an end material region between adjacent products in the first substrate separately from scribe lines used to cut out a product on the first substrate side before the step (a), after the step (a) or after the step (b) are carried out.