发明名称 |
Three dimensional memory and methods of forming the same |
摘要 |
Some embodiments include a memory device and methods of forming the memory device. One such memory device includes a first group of memory cells, each of the memory cells of the first group being formed in a cavity of a first control gate located in one device level of the memory device. The memory device also includes a second group of memory cells, each of the memory cells of the second group being formed in a cavity of a second control gate located in another device level of the memory device. Additional apparatus and methods are described. |
申请公布号 |
US8803214(B2) |
申请公布日期 |
2014.08.12 |
申请号 |
US201012825211 |
申请日期 |
2010.06.28 |
申请人 |
Micron Technology, Inc. |
发明人 |
Tang Sanh D.;Zahurak John K. |
分类号 |
H01L27/06;H01L27/10;H01L27/115;H01L29/66 |
主分类号 |
H01L27/06 |
代理机构 |
Schwegman, Lundberg & Woessner, P.A. |
代理人 |
Schwegman, Lundberg & Woessner, P.A. |
主权项 |
1. An apparatus comprising:
a substrate of a memory device; a plurality of first memory cells located in a first device level of the memory device over the substrate; a plurality of second memory cells located in a second device level of the memory device over the first device level and over the substrate, wherein the first device level is different from the second device level; a first control gate formed in the first device level, the first control gate to control access to the first memory cells, wherein each of the first memory cells includes a memory element formed in a cavity of the first control gate; a second control gate formed in the second device level, the second control gate to control access to the second memory cells, wherein each of the second memory cells includes a memory element formed in a cavity of the second control gate; and data lines configured to be selectively coupled to a common source and the memory cells through conductive material. |
地址 |
Boise ID US |