发明名称 Three dimensional memory and methods of forming the same
摘要 Some embodiments include a memory device and methods of forming the memory device. One such memory device includes a first group of memory cells, each of the memory cells of the first group being formed in a cavity of a first control gate located in one device level of the memory device. The memory device also includes a second group of memory cells, each of the memory cells of the second group being formed in a cavity of a second control gate located in another device level of the memory device. Additional apparatus and methods are described.
申请公布号 US8803214(B2) 申请公布日期 2014.08.12
申请号 US201012825211 申请日期 2010.06.28
申请人 Micron Technology, Inc. 发明人 Tang Sanh D.;Zahurak John K.
分类号 H01L27/06;H01L27/10;H01L27/115;H01L29/66 主分类号 H01L27/06
代理机构 Schwegman, Lundberg & Woessner, P.A. 代理人 Schwegman, Lundberg & Woessner, P.A.
主权项 1. An apparatus comprising: a substrate of a memory device; a plurality of first memory cells located in a first device level of the memory device over the substrate; a plurality of second memory cells located in a second device level of the memory device over the first device level and over the substrate, wherein the first device level is different from the second device level; a first control gate formed in the first device level, the first control gate to control access to the first memory cells, wherein each of the first memory cells includes a memory element formed in a cavity of the first control gate; a second control gate formed in the second device level, the second control gate to control access to the second memory cells, wherein each of the second memory cells includes a memory element formed in a cavity of the second control gate; and data lines configured to be selectively coupled to a common source and the memory cells through conductive material.
地址 Boise ID US