Footprint on PCB for leadframe-based packages

摘要

A footprint of a printed circuit board (PCB) for a leadframe-based package includes a plurality of pads arranged within a central region on a main surface of the PCB; and an array of signal pads disposed within a peripheral region surrounding the central region.

主权项

1. A footprint of a printed circuit board (PCB) for a leadframe-based package, the PCB having a main surface, the footprint comprising:
a plurality of pads arranged within a central region on the main surface of the PCB; and an array of signal pads disposed within a peripheral region surrounding the central region, wherein a surface area of each of the plurality of pads arranged within the central region is bigger than a surface area of each of the array of signal pads disposed within the peripheral region, wherein a total surface area of the plurality of pads arranged within the central region is less than 50% of the surface area of the central region.