Miniaturized wide-band baluns for RF applications

摘要

A wide-band balun device includes a first metallization deposited over a substrate and oriented in a first coil. The first coil extends horizontally across the substrate while maintaining a substantially flat vertical profile. A second metallization is deposited over the substrate and oriented in a second coil. The second coil is magnetically coupled to the first coil and a portion of the second coil oriented interiorly of the first coil. A third metallization is deposited over the substrate and oriented in a third coil. The third coil is magnetically coupled to the first and second coils. A first portion of the third coil is oriented interiorly of the second coil. The third coil has a balanced port connected to the third coil between second and third portions of the third coil.

主权项

1. A wide-band balun device, comprising:
a first coil formed at a first level over a substrate in a wound configuration extending horizontally across the substrate; a second coil formed at the first level over the substrate in a wound configuration adjacent to the first coil, the second coil being magnetically coupled to the first coil; and a third coil formed at the first level over the substrate in a wound configuration adjacent to the first coil and second coil, the third coil being magnetically coupled to the first coil and second coil, wherein the first, second, and third coils have a substantially flat vertical profile with respect to each other and are arranged over the substrate as a single integrated structure.