Direct bonding of heat conducting foam and substrates

摘要

A technique for joining porous foam material, such as graphite, metal or ceramic foam, to a substrate is described. The substrate can be metal, a thermoset plastic or a composite material. The substrate has a melting point below that of the foam material. The two are joined together by using the foam to apply heat locally at the surface of the substrate. Some or all of the foam is heated to the appropriate temperature at or above the melting point of the substrate material. The foam and the substrate are then brought together, with the heat from the foam melting or softening the substrate material so that the substrate material infuses into the pores of the foam. As the foam cools below the melting point temperature, the substrate material solidifies to create a mechanical bond between the foam and the substrate.

主权项

1. A method of direct bonding a porous foam to a substrate, comprising:
heating a portion of the porous foam that is intended to be in contact with the substrate to a temperature at or above the melting point temperature of the substrate; and bringing the heated portion of the porous foam and the substrate together so that a portion of the substrate is heated sufficiently to melt or soften enough to infuse into pores of the foam and a remaining portion of the substrate structure is unchanged; and while holding the heated portion of the porous foam and the substrate together, allowing the heated portion of the foam to cool below the melting point temperature so that the heated portion of the substrate material solidifies, thereby creating a mechanical bond between the substrate and the foam.