发明名称 |
Electronic device with heat dissipation structure |
摘要 |
An electronic device includes a computer, a circuit board, a supporting base attached to a top surface of the circuit board, and a backboard attached to a bottom surface of the circuit board. The case includes a bottom plate. The circuit board defines a through hole. A CPU is located on the supporting base. The backboard defines a retaining hole. The supporting base defines a fixing hole. A heat sink is attached to the supporting base and contacted the CPU. A fixing member is engaged with the retaining hole, the fixing hole and the through hole, to engage the backboard and the supporting base to the circuit board. |
申请公布号 |
US8804330(B2) |
申请公布日期 |
2014.08.12 |
申请号 |
US201113277163 |
申请日期 |
2011.10.19 |
申请人 |
Hong Fu Jin Precision Industry (WuHan) Co., Ltd.;Hon Hai Precision Industry Co., Ltd. |
发明人 |
Zeng Biao;Zhang Zhi-Guo;Tao Heng;Geng Chao |
分类号 |
G06F1/20 |
主分类号 |
G06F1/20 |
代理机构 |
Novak Druce Connolly Bove + Quigg LLP |
代理人 |
Novak Druce Connolly Bove + Quigg LLP |
主权项 |
1. An electronic device comprising:
a case comprising a bottom plate; a backboard attached to the bottom plate; a flange extending from the backboard, and the backboard comprising a mounting piece directly connected to the flange; the flange substantially perpendicular to the mounting piece and the backboard, and the mounting piece secured to the bottom plate; a circuit board attached to the backboard; a supporting base attached to a top surface of the circuit board; a CPU located on the supporting base; a heat sink attached to the supporting base and contacting the CPU; and a fixing member; wherein the fixing member engages the backboard and the supporting base to the circuit board. |
地址 |
Wuhan CN |