发明名称 Electronic device with heat dissipation structure
摘要 An electronic device includes a computer, a circuit board, a supporting base attached to a top surface of the circuit board, and a backboard attached to a bottom surface of the circuit board. The case includes a bottom plate. The circuit board defines a through hole. A CPU is located on the supporting base. The backboard defines a retaining hole. The supporting base defines a fixing hole. A heat sink is attached to the supporting base and contacted the CPU. A fixing member is engaged with the retaining hole, the fixing hole and the through hole, to engage the backboard and the supporting base to the circuit board.
申请公布号 US8804330(B2) 申请公布日期 2014.08.12
申请号 US201113277163 申请日期 2011.10.19
申请人 Hong Fu Jin Precision Industry (WuHan) Co., Ltd.;Hon Hai Precision Industry Co., Ltd. 发明人 Zeng Biao;Zhang Zhi-Guo;Tao Heng;Geng Chao
分类号 G06F1/20 主分类号 G06F1/20
代理机构 Novak Druce Connolly Bove + Quigg LLP 代理人 Novak Druce Connolly Bove + Quigg LLP
主权项 1. An electronic device comprising: a case comprising a bottom plate; a backboard attached to the bottom plate; a flange extending from the backboard, and the backboard comprising a mounting piece directly connected to the flange; the flange substantially perpendicular to the mounting piece and the backboard, and the mounting piece secured to the bottom plate; a circuit board attached to the backboard; a supporting base attached to a top surface of the circuit board; a CPU located on the supporting base; a heat sink attached to the supporting base and contacting the CPU; and a fixing member; wherein the fixing member engages the backboard and the supporting base to the circuit board.
地址 Wuhan CN