| 发明名称 | Electrostatic chuck and a method for supporting a wafer | ||
| 摘要 | An electrostatic chuck includes an isolating substrate that surrounds at least one electrode; multiple protrusions having upper portions arranged to contact a wafer; and at least one discharging element positioned between the at least one electrode and the upper portions of the multiple protrusions; which discharging element, once coupled to a discharging circuit, is arranged to discharge charge accumulated in the isolating substrate. | ||
| 申请公布号 | US8804299(B2) | 申请公布日期 | 2014.08.12 |
| 申请号 | US201213371909 | 申请日期 | 2012.02.13 |
| 申请人 | Applied Materials Israel, Ltd. | 发明人 | Eytan Guy;Nakash Shmuel Shmulik;Chirko Konstantin |
| 分类号 | H01T23/00 | 主分类号 | H01T23/00 |
| 代理机构 | Kilpatrick Townsend & Stockton LLP | 代理人 | Kilpatrick Townsend & Stockton LLP |
| 主权项 | 1. An electrostatic chuck, comprising: an isolating substrate that surrounds multiple electrodes; multiple protrusions having upper portions arranged to contact a wafer; multiple discharging elements each positioned between one of the multiple electrodes and the upper portions of the multiple protrusions; wherein the multiple discharging elements are arranged to discharge charge accumulated in the isolating substrate. | ||
| 地址 | Rehovot IL | ||