发明名称 High electron mobility transistor and method of forming the same
摘要 A High Electron Mobility Transistor (HEMT) includes a first III-V compound layer having a first band gap, and a second III-V compound layer having a second band gap over the first III-V compound layer. The second band gap is greater than the first band gap. A crystalline interfacial layer is overlying and in contact with the second III-V compound layer. A gate dielectric is over the crystalline interfacial layer. A gate electrode is over the gate dielectric. A source region and a drain region are over the second III-V compound layer, and are on opposite sides of the gate electrode.
申请公布号 US8803158(B1) 申请公布日期 2014.08.12
申请号 US201313769785 申请日期 2013.02.18
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Chiu Han-Chin;Liu Po-Chun;Chen Chi-Ming;Yu Chung-Yi;Wong King-Yuen
分类号 H01L31/0256 主分类号 H01L31/0256
代理机构 Slater and Matsil, L.L.P. 代理人 Slater and Matsil, L.L.P.
主权项 1. A High Electron Mobility Transistor (HEMT) comprising: a first III-V compound layer having a first band gap; a second III-V compound layer having a second band gap over the first III-V compound layer, wherein the second band gap is greater than the first band gap; a crystalline interfacial layer over and in contact with the second III-V compound layer; a gate dielectric over the crystalline interfacial layer; a gate electrode over the gate dielectric; and a source region and a drain region over the second III-V compound layer and on opposite sides of the gate electrode.
地址 Hsin-Chu TW