发明名称 |
High electron mobility transistor and method of forming the same |
摘要 |
A High Electron Mobility Transistor (HEMT) includes a first III-V compound layer having a first band gap, and a second III-V compound layer having a second band gap over the first III-V compound layer. The second band gap is greater than the first band gap. A crystalline interfacial layer is overlying and in contact with the second III-V compound layer. A gate dielectric is over the crystalline interfacial layer. A gate electrode is over the gate dielectric. A source region and a drain region are over the second III-V compound layer, and are on opposite sides of the gate electrode. |
申请公布号 |
US8803158(B1) |
申请公布日期 |
2014.08.12 |
申请号 |
US201313769785 |
申请日期 |
2013.02.18 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chiu Han-Chin;Liu Po-Chun;Chen Chi-Ming;Yu Chung-Yi;Wong King-Yuen |
分类号 |
H01L31/0256 |
主分类号 |
H01L31/0256 |
代理机构 |
Slater and Matsil, L.L.P. |
代理人 |
Slater and Matsil, L.L.P. |
主权项 |
1. A High Electron Mobility Transistor (HEMT) comprising:
a first III-V compound layer having a first band gap; a second III-V compound layer having a second band gap over the first III-V compound layer, wherein the second band gap is greater than the first band gap; a crystalline interfacial layer over and in contact with the second III-V compound layer; a gate dielectric over the crystalline interfacial layer; a gate electrode over the gate dielectric; and a source region and a drain region over the second III-V compound layer and on opposite sides of the gate electrode. |
地址 |
Hsin-Chu TW |