发明名称 High intensity light source
摘要 A light source comprises a heat-sink having a mounting region, and heat-dissipating fins, a base housing having an inner cavity and coupled to the heat-sink, and an integrated lighting module including: a printed circuit board; an LED on a substrate coupled to the printed circuit board within a first lateral region of the printed circuit board, and an electronic driving circuit for providing power to the LED and coupled to the printed circuit board within a second lateral region of the printed circuit board, wherein a bottom surface of the substrate is thermally coupled to the mounting region of the heat-sink, and wherein the second lateral region of the integrated lighting module is located within the inner cavity of the base housing.
申请公布号 US8803452(B2) 申请公布日期 2014.08.12
申请号 US201113269193 申请日期 2011.10.07
申请人 Soraa, Inc. 发明人 Shum Frank Tin Chung;Jue Clifford
分类号 H05K3/30;F21V17/00 主分类号 H05K3/30
代理机构 Kilpatrick Townsend & Stockton LLP 代理人 Kilpatrick Townsend & Stockton LLP
主权项 1. A light source comprising: a heat-sink comprising; an inner core region;a mounting region disposed within the inner core region; anda plurality of heat-dissipating fins extending from the inner core region;wherein the plurality of heat-dissipating fins and the mounting region define an inner cavity and a through slot adjacent the mounting region; a base housing disposed within the inner cavity; and an integrated lighting module comprising: a flexible printed circuit;a light emitting source formed on a top surface of a substrate, wherein the top surface of the substrate is mechanically and electrically coupled to a first region of the flexible printed circuit;an electronic driving circuit configured to provide electrical power to the light emitting source, wherein the electronic driving circuit is mechanically and electrically coupled to a second region of the flexible printed circuit; andan electrical connector mechanically and electrically coupled to an end of the flexible printed circuit; wherein: a bottom surface of the substrate is mechanically and thermally coupled to the mounting region of the heat-sink,the second region of the flexible printed circuit is disposed within the base housing, anda portion of the flexible printed circuit between the first region and the second region is disposed within the through slot.
地址 Fremont CA US
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