发明名称 Module socket
摘要 The Present Disclosure is a module socket for mounting a module on a mounting member, in which the module socket has a first connector including a flat housing, a first conductive pattern arranged on the mating side surface of the housing, and a male terminal protruding from a surface of the first conductive pattern, and a flat second connector formed from plate-shaped metal and including a female terminal elastically interposing the male terminal, and in which either the first conductor or the second conductor is attached to the module and the other is attached to the mounting member.
申请公布号 US8801439(B2) 申请公布日期 2014.08.12
申请号 US201213451747 申请日期 2012.04.20
申请人 Molex Incorporated 发明人 Sato Eriko;Niitsu Toshihiro;Suzuki Hirokazu;Tezuka Akihiro;Nagasawa Hideo
分类号 H01R12/00;H05K7/10;H01R13/193 主分类号 H01R12/00
代理机构 代理人 Morella Timothy M.
主权项 1. A module socket for mounting a module on a mounting member, the module socket comprising: a first connector, the first connector including a flat housing; a first conductive pattern, the first conductive pattern being arranged on a mating side surface of the flat housing; a male terminal, the male terminal protruding from a surface of the first conductive pattern; and a flat second connector, the second connector being formed from plate-shaped metal and including a female terminal, the female terminal elastically interposing the male terminal and formed by patterning a second conductive pattern in plate-shaped metal, the female terminal including an inner opening formed on the inside thereof and a base connected to a portion of the second conductive pattern surrounding the female terminal; wherein: one of the first connector or the second connector is attached to the module, and the other is attached to the mounting member;the connectors are mated by sliding, after the mating surfaces thereof face each other.
地址 Lisle IL US