发明名称 Pixel structure having metal-insulator-semiconductor capacitor
摘要 A pixel structure including a scan line, a data line, an active device, a pixel electrode, a capacitor electrode line, a semi-conductive pattern layer and at least one dielectric layer is provided. The active device is electrically connected to the scan line and the data line. The pixel electrode is electrically connected to the active device. The capacitor electrode line is located under the pixel electrode. A first storage capacitor is formed between the capacitor electrode line and the pixel electrode. The semi-conductive pattern layer is disposed between the capacitor electrode line and the pixel electrode, the pixel electrode is electrically connected to the semi-conductive pattern layer. A second storage capacitor is formed between the semi-conductive pattern layer and the capacitor electrode line. The dielectric layer is disposed between the capacitor electrode line and the pixel electrode and located between the semi-conductive pattern layer and the capacitor electrode line.
申请公布号 US8804059(B2) 申请公布日期 2014.08.12
申请号 US201113025178 申请日期 2011.02.11
申请人 Au Optronics Corporation 发明人 Cheng Hsiao-Wei;Lin Sung-Hui;Huang Ming-Yung;Liu Pin-Miao;Wu Wen-Shin;Huang Chun-Yao;Yu Wei-Sheng
分类号 G02F1/1343;H01L29/04;H01L29/10;H01L31/00;H01L27/14;H01L29/15;H01L31/036 主分类号 G02F1/1343
代理机构 Jiang Chyun IP Office 代理人 Jiang Chyun IP Office
主权项 1. A pixel structure, comprising: a scan line and a data line; an active device, electrically connected to the scan line and the data line; a pixel electrode, electrically connected to the active device; a capacitor electrode line, located underneath the pixel electrode; a semi-conductive pattern layer, disposed between the capacitor electrode line and the pixel electrode, wherein the pixel electrode is electrically connected to the semi-conductive pattern layer; at least one dielectric layer, disposed between the capacitor electrode line and the pixel electrode, wherein the at least one dielectric layer comprises a first dielectric layer, disposed between the semi-conductive pattern layer and the capacitor electrode line, and a second dielectric layer, covering the first dielectric layer; and a storage electrode pattern layer, disposed between the pixel electrode and the capacitor electrode line, and a portion of the storage electrode pattern layer is directly contacted with the first dielectric layer, wherein the storage electrode pattern layer is narrower than the capacitor electrode line and wider than the semi-conductive pattern layer, the storage electrode pattern layer is electrically connected to the pixel electrode, wherein the second dielectric layer covers the storage electrode pattern layer, the first dielectric layer and the second dielectric layer are sandwiched between the pixel electrode and the capacitor electrode line, and the first dielectric layer is sandwiched between the storage electrode pattern layer and the capacitor electrode line, wherein the capacitor electrode line and the pixel electrode have a first overlap region not overlapped with the semi-conductive pattern layer and the capacitor electrode line in a direction substantially normal to a surface of the semi-conductive pattern layer constitute a first storage capacitor having a first storage capacitance, the semi-conductive pattern layer and the capacitor electrode line having a second overlap region in the direction substantially normal to the surface of the semi-conductive pattern layer constitute a second storage capacitor having a second storage capacitance, and the storage electrode pattern layer and the capacitor electrode line having a third overlap region not overlapped with the semi-conductive pattern layer in the direction substantially normal to the surface of the semi-conductive pattern layer constitute a third storage capacitor having a third storage capacitance, and wherein a total storage capacitance is the sum of the first storage capacitance, the second storage capacitance, and the third storage capacitance, the second storage capacitance occupies 30%-80% of the total storage capacitance, and each of the first storage capacitance, the second storage capacitance, and the third storage capacitance is larger than zero.
地址 Hsinchu TW