发明名称 Piezoelectric device with asymmetrically mounted tuning-fork type piezoelectric vibrating piece
摘要 The piezoelectric device comprises a piezoelectric vibrating piece having a base portion, a pair of vibrating arms extending in a specified direction from the base portion, and a pair of connection portions disposed on the pair of the supporting arms; a package having a bottom surface which accommodates the piezoelectric vibrating piece and side faces surrounding the bottom surface, in which a pair of electrode pads corresponding to the connection portions are formed on the bottom surface; and adhesive for bonding the pair of the electrode pads with the pair of connection portions. One electrode pad and the other electrode pad, with adhesive applied to the electrode pads, are shifted with respect to each other in a predetermined direction.
申请公布号 US8803407(B2) 申请公布日期 2014.08.12
申请号 US201113093089 申请日期 2011.04.25
申请人 Nihon Dempa Kogyo Co., Ltd. 发明人 Kawase Yuichi;Motegi Toshiaki;Kawanishi Shingo
分类号 H01L41/04;H03H9/21;H03H9/10 主分类号 H01L41/04
代理机构 Alix, Yale & Ristas, LLP 代理人 Alix, Yale & Ristas, LLP
主权项 1. A piezoelectric device comprising: a piezoelectric vibrating piece having a base portion, a pair of vibrating arms extending in a specified direction from the base portion, a pair of supporting arms extending from the base portion, and only one pair of connection portions disposed on the pair of the supporting arms; a package having a bottom surface which accommodates the piezoelectric vibrating piece and side faces surrounding the bottom surface, in which a pair of electrode pads corresponding to the connection portions are formed on the bottom surface; and adhesive for bonding the pair of the electrode pads with the pair of connection portions, wherein one electrode pad and the other electrode pad, with adhesive applied to the electrode pads, are shifted with respect to each other in a predetermined direction and a connection between said piezoelectric vibrating piece and said package consists essentially of said adhesive bonding said pair of electrode pads with said one pair of connection portions.
地址 Tokyo JP