Three-dimensional chip stack and method of forming the same

摘要

A three dimensional (3D) chip stack includes a first chip bonded to a second chip. The first chip includes a first bump structure overlying the first substrate, and the second chip includes a second bump structure overlying the second substrate. The first bump structure is attached to the second bump structure, and a joining region is formed between the first bump structure and the second bump structure. The joining region is a solderless region which includes a noble metal.

主权项

1. A device, comprising:
a first chip comprising a first substrate and a first bump structure overlying the first substrate; and a second chip comprising a second substrate and a second bump structure overlying the second substrate, the first chip being bonded to the second chip by a solderless joint between the first bump structure and the second bump structure, the solderless joint having a joining region between the first bump structure and the second bump structure, wherein the joining region between the first chip and the second chip comprises a noble metal, the first bump structure comprises a metallization layer overlying the first substrate and a protection layer formed between the ioining region and the metallization layer, and a region between the first and the second chip is free from an adhesive material.