发明名称 Wafer level camera module with snap-in latch
摘要 An apparatus includes an image sensor module with a lens stack disposed on the image sensor module. A protective tube is disposed on the image sensor module and encloses the lens stack. The protective tube includes an outer wall having a snap-in latch element disposed thereon. A metal housing encloses the protective tube. The metal housing includes a housing foot and inner wall having an opposite snap-in latch element disposed thereon. The image sensor module is adapted to be secured between the housing foot of the metal housing and the protective tube when the opposite snap-in latch element of the metal housing is engaged with the snap-in latch element of the protective tube.
申请公布号 US8804032(B2) 申请公布日期 2014.08.12
申请号 US201213435596 申请日期 2012.03.30
申请人 OmniVision Technologies, Inc. 发明人 Leung Kevin Ka Kei;Lin Wen Hua
分类号 H04N5/225;G03B17/02 主分类号 H04N5/225
代理机构 Blakely Sokoloff Taylor & Zafman LLP 代理人 Blakely Sokoloff Taylor & Zafman LLP
主权项 1. An apparatus comprising: an image sensor module; a lens stack disposed on the image sensor module, the lens stack including a plurality of lenses, a plurality of glass wafers, and a plurality of spacers; a protective tube disposed on the image sensor module and enclosing the lens stack, the protective tube including an outer wall having a snap-in latch element disposed thereon; anda metal housing enclosing the protective tube, the metal housing including a housing foot and inner wall having an opposite snap-in latch element disposed thereon, wherein the image sensor module is adapted to be secured and aligned between the housing foot of the metal housing and the protective tube when the opposite snap-in latch element of the metal housing is engaged with the snap-in latch element of the protective tube, wherein the protective tube.
地址 Santa Clara CA US