High temperature operating package and circuit design

摘要

The invention provides a semiconductor device that is thermally isolated from the printed circuit board such that the device operates at a higher temperature and radiates heat away from the printed circuit board. In another embodiment, the semiconductor is stacked onto a second device and optionally thermally isolated from the second device.

主权项

1. A circuit comprising:
a high temperature power device having a first source region, a first gate region and a first drain region; a series power device having a second source region, a second gate region and a second drain region, the second source region facing the first drain region; and a thermal resistance layer between the high temperature power device and the series power device, the thermal resistance layer providing an electrical connection between the first drain and the second source.