Light emitting diode package and method of fabricating the same

摘要

A light emitting diode package and a method of fabricating the same. The package includes a light emitting diode chip having a first surface and a second surface opposing the first surface, a metal frame (or TAB tape) having leads connected to the light emitting diode chip, and a light-pervious encapsulant encapsulating the light emitting diode chip, wherein the second surface of the chip is exposed from the first light-pervious encapsulant. The metal frame (or TAB tape) connects the light emitting diode chip to an external circuit board. The LED package does not need wire-bonding process. A method of fabricating a light emitting diode package is also provided.

主权项

1. A light emitting diode package, comprising:
a light emitting diode chip having a first surface and a second surface opposing the first surface; at least a first electrode pad formed on the first surface of the light emitting diode chip; a metal frame having at least a first lead electrically connected to the at least a first electrode pad; and a support layer having a plurality of opening areas, and wherein the at least a first lead each has a first end connected to the at least a first electrode pad and a second end opposing the first end, and both of the first end and the second end are exposed from a corresponding one of the opening areas of the support layer and free from being in contact with the support layer.