| 发明名称 | Method of fabricating a semiconductor device having an interposer | ||
| 摘要 | The method of fabricating a semiconductor device may include forming a semiconductor die on a substrate, forming an interposer including at least one integrated circuit connected to the semiconductor die on the substrate or on the semiconductor die, and performing encapsulation to surround the semiconductor die and the interposer. | ||
| 申请公布号 | US8802494(B2) | 申请公布日期 | 2014.08.12 |
| 申请号 | US201213454972 | 申请日期 | 2012.04.24 |
| 申请人 | Amkor Technology Korea, Inc. | 发明人 | Lee Choon Heung;Bae Ki Cheol;Na Do Hyun |
| 分类号 | H01L21/00;H01L21/82 | 主分类号 | H01L21/00 |
| 代理机构 | Workman Nydegger | 代理人 | Workman Nydegger |
| 主权项 | 1. A method of fabricating a semiconductor device, the method comprising: forming a semiconductor die on a substrate, wherein the semiconductor die comprises through electrodes passing through the semiconductor die; forming an interposer including at least one integrated circuit connected to the semiconductor die therein on the substrate or on the semiconductor die; coupling side interposers electrically on the sides of at least one of the semiconductor die and interposer; and performing encapsulation to surround the semiconductor die, the interposer, and the side interposers. | ||
| 地址 | Seoul KR | ||