发明名称 |
Light-emitting device |
摘要 |
A light-emitting device includes a light-emitting element and a heat-conducting and electrically-insulating element. The light-emitting element includes at least one first conductive frame having at least one first electrically-conducting portion and at least one heat-dissipating portion, at least one second conductive frame adjacent to the first conductive frame and having at least one second electrically-conducting portion, a casing enclosing the first conductive frame and the second conductive frame, and at least one light-emitting chip disposed on the first conductive frame. The heat-conducting and electrically-insulating element includes a heat-conducting and electrically-insulating layer disposed on the heat-dissipating portion for insulating an electrical current from the heat-dissipating portion. Hence, the instant disclosure can plan a heat-conduction path and an electric-conduction path for the light-emitting chip to effectively increase the heat-dissipating efficiency of the light-emitting element due to the design of placing the heat-conducting and electrically-insulating layer on the heat-dissipating portion. |
申请公布号 |
US8801238(B2) |
申请公布日期 |
2014.08.12 |
申请号 |
US201213494030 |
申请日期 |
2012.06.12 |
申请人 |
Lite-On Electronics (Guangzhou) Limited;Lite-On Technology Corporation |
发明人 |
Hsu Shih-Chang;Lee Tsung-Chi;Li Po-Wei |
分类号 |
B60Q1/06 |
主分类号 |
B60Q1/06 |
代理机构 |
Li & Cai Intellectual Property (USA) Office |
代理人 |
Li & Cai Intellectual Property (USA) Office |
主权项 |
1. A light-emitting device, comprising:
a light-emitting element including:
at least one first conductive frame having at least one first electrically-conducting portion and at least one heat-dissipating portion;at least one second conductive frame adjacent to the at least one first conductive frame and having at least one second electrically-conducting portion;a casing enclosing the at least one first conductive frame and the at least one second conductive frame, the at least one first electrically-conducting portion, the at least one heat-dissipating portion and the at least one second electrically-conducting portion being exposed from the casing; andat least one light-emitting chip disposed on the at least one first conductive frame; and a heat-conducting and electrically-insulating element including at least one heat-conducting and electrically-insulating layer disposed on the at least one heat-dissipating portion for insulating an electrical current from the at least one heat-dissipating portion; wherein the light-emitting element has an electrical conduction path passing through the at least one first electrically-conducting portion and the at least one second electrically-conducting portion; wherein the light-emitting element has a heat-conduction path passing through the heat-dissipation portion and the heat-conducting and electrically-insulating element. |
地址 |
Guangzhou CN |