Semiconductor package

摘要

A semiconductor package includes a substrate; a driving chip having first bumps on a first surface and bump pads on a second surface facing away from the first surface, and mounted to the substrate by the medium of the first bumps; a support member disposed on the substrate substantially horizontally with respect to the driving chip; and a plurality of memory chips substantially horizontally disposed on the driving chip and the support member such that one corner portions of the memory chips are positioned on the driving chip while being centered about the driving chip, wherein the respective memory chips have second bumps which are electrically connected with the respective bump pads of the driving chip, on one surfaces of the one corner portions of the memory chips which face the driving chip.

主权项

1. A semiconductor package comprising:
a substrate; a driving chip having a first surface on which first bumps are formed and a second surface facing away from the first surface and on which bump pads are formed, wherein the driving chip is configured to mount on the substrate using the first bumps as an electrically connected member; a support member disposed on the substrate substantially horizontal with respect to the driving chip; and a plurality of memory chips substantially horizontal disposed on the driving chip and the support member such that one corner portions of the memory chips are positioned on the driving chip while being centered about the driving chip, wherein each of the memory chips has second bumps which are electrically connected with the bump pads of the driving chip, respectively and are disposed on one surfaces of the one corner portions of the memory chips which face the driving chip.