发明名称 Compression molding machine
摘要 In order to achieve reduction of a space occupied in a plant for manufacturing pharmaceutical tablets or the like, there is provided a compression molding machine that includes a table, an upper punch and a lower punch, a molded product collection mechanism, a molded product reservoir, and a housing for accommodating a connection end of an air convey path connected to the molded product reservoir. In this configuration, there is no need to additionally provide a dust removing device or a lifter outside the machine.
申请公布号 US8801416(B2) 申请公布日期 2014.08.12
申请号 US201113317695 申请日期 2011.10.26
申请人 Kikusui Seisakusho Ltd. 发明人 Uneme Tomoki
分类号 B29C43/06;B29C43/08 主分类号 B29C43/06
代理机构 McGinn IP Law Group, PLLC 代理人 McGinn IP Law Group, PLLC
主权项 1. A compression molding machine, comprising: a table comprising at least one die hole penetrating in a vertical direction; paired upper and lower punches each comprising a tip for sliding in the die hole to compress and mold a powdery material filled in the die hole; a molded product collection mechanism for collecting a molded product extracted from the die hole in the table; a molded product reservoir for temporarily reserving the molded product collected by the molded product collection mechanism; a convey path connected to the molded product reservoir so as to allow the molded product temporarily being reserved to be conveyed therealong; a housing for accommodating the table, the upper punch, the lower punch, the molded product collection mechanism, the molded product reservoir, and a connection end of the convey path, the connection end being connected to the molded product reservoir, wherein the convey path extends with an inclined angle above a lower surface of the molded product reservoir; and a gas supply device for supplying air into the convey path to carry the molded product along an inner peripheral surface of the convey path, wherein the gas supply device is connected to the connection end of the convey path for blowing the air into the convey path in a direction along the inner peripheral surface of the convey path, wherein the convey path is configured to allow the air and the molded product to be sucked from the molded product reservoir into the convey path, and wherein the air and the molded product are sucked spirally in a whirl along the inner peripheral surface of the convey path to flow away from the connection end.
地址 Kyoto-Shi, Kyoto JP