Housing for electronic devices and method for making housing

摘要

A housing for an electronic device includes a substrate made of plastic, a base paint layer, a pattern layer, a tin layer, a silicon oxide layer, and a top paint layer. The substrate has an outer surface and an inner surface opposite to the outer surface and facing the interior of the electronic device. The base paint layer is formed on the outer surface. The pattern layer is directly formed on the base paint layer and partially covers the base paint layer. The tin layer is directly formed on the pattern layer and covers the pattern layer and portions of the base paint layer not covered by the pattern layer. The silicon oxide layer is directly formed on the entire tin layer. The top paint layer is formed on the silicon oxide layer. A method for making the housing is also described.

主权项

1. A housing for an electronic device, comprising:
a substrate made of plastic, the substrate having an outer surface and an inner surface opposite to the outer surface; a base paint layer formed on the outer surface; a pattern layer directly formed on the base paint layer and partially covering the base paint layer; a tin layer directly formed on the pattern layer and covering the pattern layer and portions of the base paint layer not covered by the pattern layer, the tin layer having a thickness less than 0.1 μm; a silicon oxide layer directly formed on the entire tin layer; and a top paint layer formed on the silicon oxide layer.