Method of manufacturing printed circuit board

摘要

Embodiments of the invention provide a method of manufacturing a printed circuit board, including: mounting a strip substrate on a fixing member; separating the strip substrate into unit substrates by performing a singulation process; attaching solder balls onto the unit substrates using a jig; and fixing the solder balls on the unit substrates by performing a reflow process. The method of manufacturing a printed circuit board is advantageous in that the solder balls can be accurately formed at the predetermined positions of the strip substrate because they are attached to the unit substrates after the warpage of the strip substrate was reduced by a singulation process.

主权项

1. A method of manufacturing a printed circuit board, comprising:
mounting a strip substrate on a fixing member; separating the strip substrate into unit substrates equipped with a pad in a state in which a plurality of unit substrates is integrally mounted on the fixing member by performing a singulation process; attaching solder balls onto the pad of the unit substrates using a jig in a state in which the plurality of unit substrates separated from the strip substrate is integrally mounted on the fixing member; and fixing the solder balls on the unit substrates by performing a reflow process.