| 摘要 |
<p>Hotmelt adhesive for bonding substrates comprises (parts by weight based on 100 parts by weight of polymer (phr)): a) at least one ethylene-vinyl acetate copolymer having a vinyl acetate content of 40-90 wt.% (5-70, preferably 10-60); b) at least one styrene block copolymer (30-95, preferably 40-90); and c) at least one tackifying resin (20-200, preferably 25-130). An independent claim is included for a process for preparing the hotmelt adhesives involving mixing the components (a), b) and (c) and optionally at least one paraffinic, naphthenic or aromatic plasticizer oil or plasticizer of the ester type; and at least one further additive selected from aging inhibitors, dyes or antistatic additives with one another at 140 to 190[deg] C.</p> |
