| 摘要 |
The present invention relates to a method for manufacturing a flexible printed circuit board, and a flexible printed circuit board manufactured thereby. The method for manufacturing a flexible printed circuit board comprises a step (S10) of preparing an alumina substrate (11); a step (S20) of forming a circuit pattern (13) on the alumina substrate (11) by using a conductive paste; a step (S30) of sintering the alumina substrate (11), on which the circuit pattern (13) is formed, at a temperature of 700 to 900°C; and a step (S50) of transferring the circuit pattern (13) formed on the alumina substrate (11) to a bonding sheet (15) by aligning and compressing the alumina substrate (11), on which the circuit pattern (13) is formed, with respect to the bonding sheet (15) after the sintering step. According to the present invention, the circuit pattern can be formed by printing a cheap silver paste on the alumina substrate. The circuit pattern having a reduced electrical resistance can be formed by sintering at a high temperature. The flexible printed circuit board can be manufactured by transferring the formed circuit pattern to the bonding sheet, thereby considerably reducing the manufacturing costs of the flexible printed circuit board. |
