Package-based filtering and matching solutions

摘要

A microelectronic package having a radio frequency (RF) amplifier circuit and, incorporating harmonic rejection filters and matching circuits integrally formed in the package is disclosed. A harmonic rejection filter may comprise a metal-insulator-metal (MIM) capacitor serially coupled between bond pads disposed on a RF amplifier circuit die, a first wire bond coupling a first bond pad to a package output, where the first bond pad is coupled to the output of the RF amplifier, and a second wire bond coupling a second bond pad to a package ground. The harmonic rejection filter may be appropriately configured to filter one or more harmonics at different frequencies.

主权项

1. A method of operating a microelectronic package, comprising:
receiving a signal; processing the signal through a first filter integrally formed microelectronic package to provide a first harmonic rejection, the first filter including:
a first metal-insulator-metal (MIM) capacitor serially coupled between a plurality of the bond pads formed on a die having at least a radio frequency (RF) amplifier circuit formed thereon;a first wire bond coupling a first of the bond pads to a package output, wherein the first of the bond pads is coupled to an amplifier output;a second wire bond coupling a second of the bond pads to a package ground; and transmitting the signal to an output of the microelectronic package; processing the signal through a second filter integrally formed in the microelectronic package to provide a second harmonic rejection, the second filter including:
a second MIM capacitor coupled in parallel to the first MIM capacitor and between the first and a third of the bond pads;a third wire bond coupling the first of the bond pads to the output of the microelectronic package; anda fourth wire bond coupling the third of the bond pads to the package ground.