Portable computing device with thermal management

摘要

Various computing devices and methods of thermally managing the same are disclosed. In one aspect, a method of thermally managing a computing device is provided where the computing device includes a housing that has a wall adapted to contact a body part of a user, a circuit board in the housing, and a semiconductor chip coupled to the circuit board. The method includes placing a first heat spreader in thermal contact with the semiconductor chip and the circuit board but separated from the wall by a gap.

主权项

1. A method of thermally managing a computing device including a housing having a wall adapted to contact a body part of a user, a circuit board in the housing, and a semiconductor chip coupled to the circuit board, comprising:
placing a first heat spreader in thermal contact with the semiconductor chip and the circuit board, the first heat spreader being separated from the wall by a gap and not contacting the wall; and coupling a second heat spreader to the wall and separated from the first heat spreader by the gap.