发明名称 Deposition method and method for manufacturing light-emitting device
摘要 An object is to provide a deposition method for smoothly obtaining desired pattern shapes of material layers and a method for manufacturing a light-emitting device while throughput is improved when a plurality of different material layers is stacked on a substrate. A material layer is selectively formed in advance in a position overlapped with a light absorption layer over a first substrate by pump feeding. Three kinds of light-emitting layers are deposited on one deposition substrate. This first substrate and a second substrate that is to be a deposition target substrate are arranged to face each other, and the light absorption layer is heated by being irradiated with light, whereby a film is deposited on the second substrate. Three kinds of light-emitting layers can be deposited with positional accuracy by performing only one position alignment before light irradiation.
申请公布号 US8802185(B2) 申请公布日期 2014.08.12
申请号 US200912472562 申请日期 2009.05.27
申请人 Semiconductor Energy Laboratory Co., Ltd. 发明人 Yamazaki Shunpei;Tanaka Koichiro;Ikeda Hisao;Seo Satoshi
分类号 B05D5/12 主分类号 B05D5/12
代理机构 Husch Blackwell LLP 代理人 Husch Blackwell LLP
主权项 1. A method for manufacturing a light-emitting device, comprising the steps of: forming a light absorption layer on one surface of a first substrate; selectively forming a first partition over the light absorption layer; discharging a material liquid from a nozzle and forming a material layer in contact with the first partition and the light absorption layer; providing a second substrate having a first electrode and a second partition on one surface thereof so as to face the one surface of the second substrate and the one surface of the first substrate provided with the material layer; irradiating the light absorption layer with light from the other surface side of the first substrate and selectively heating at least a portion of the material layer overlapped with the light absorption layer, thereby forming a layer including an organic compound over the first electrode provided on the one surface of the second substrate; and forming a second electrode over the layer including the organic compound.
地址 JP