| 摘要 |
The present invention relates to a vacuum processing system, and more specifically to a vacuum processing system which performs a vacuum-processing procedure, such as etching and depositing, on the surface of a substrate in a vacuum state. The present invention comprises: a loading/unloading module which loads or unloads a plurality of substrates onto or from a tray; one or more process modules installed in one side of the loading/unloading module and having a closed processing space such that the tray on which the substrates are loaded is transferred and the process is carried out; a buffer module having at least one buffer unit on which the tray is temporarily loaded, which receives the tray from the loading/unloading module and then covers the upper side of the tray with a cover member having a plurality of slits before transferring it to the process module, and which receives the tray covered with the cover member from the process module and then removes the cover member from the tray before transferring it to the loading/unloading module; a transfer unit which transfers the tray between the loading/unloading module and buffer module and between the process module and buffer module. |
