| 摘要 |
<p>A semiconductor package is provided. The semiconductor package includes a first semiconductor chip which is arranged on a substrate, a second semiconductor chip which is arranged on the first semiconductor chip, multiple redistribution lines which are arranged on the first semiconductor chip, respectively, and electrically connects the first semiconductor chip and the second semiconductor chip, and a redistribution wire which is arranged on the first semiconductor chip and electrically connects one and the other among the redistribution lines.</p> |
